(Image: swop)
As globalisation accelerates and China advances its “dual-carbon” goals of carbon peaking and neutrality, the packaging industry is undergoing a period of transformation characterised by intelligence, sustainability, and flexibility. A report by Market Monitor estimates that the global smart-packaging market will reach USD 38.662 billion by 2030. The increasing integration of artificial intelligence with sustainable materials is reshaping supply chains towards greater efficiency and lower carbon intensity.
Reflecting these shifts, Shanghai World of Packaging (swop) will return to the Shanghai New International Expo Centre from 25–27 Nov, 2025. Occupying about 70,000 m², the exhibition will host more than 950 exhibitors presenting developments and solutions across the packaging value chain. Marking its tenth edition, the event will introduce several new initiatives and features aimed at enhancing knowledge exchange and industry collaboration.
Interactive demonstrations and performance testing
One of the key features of swop 2025 is the Extreme Packaging Challenge — an interactive, gamified platform allowing professionals to test and compare packaging solutions in real time. The feature will cover four areas: packaging containers; production equipment and materials; smart packaging systems; and packaging products for logistics and e-commerce.
Exhibitors will present live demonstrations converting technical specifications into practical performance tests. Examples include a paper-bag handle tested for durability under repeated folding; a steel-core strapping tape that can withstand heavy loads; biodegradable PLA cling film tested under home-composting conditions; resealable polypropylene bags tested for tear resistance; AI-driven visual sorting systems; temperature-resistant ice-cream cups; and molded pallets tested for load-bearing capacity after prolonged immersion. These hands-on demonstrations aim to help buyers identify cost-effective and high-performance solutions suited to specific operational needs.
Global packaging technologies and market insights
As part of the interpack alliance, swop connects with an international network of processing and packaging trade fairs. The exhibition will feature companies and suppliers from across Asia, Europe, Africa, the Americas, and Oceania, offering a comprehensive view of technological developments and market trends across multiple sectors, including food and beverages, pharmaceuticals, cosmetics, and industrial products.
The programme will also address current regulatory and technological topics through on-site briefings and sessions. Discussion points include compliance with EU restrictions on bisphenols in food-contact packaging, strategies to improve logistics packaging reliability in accordance with International Safe Transit Association (ISTA) standards, and the latest advances in sustainable packaging and digital automation.
10th anniversary highlights
In its tenth year, swop aims to showcase innovations spanning the full packaging value chain, including processing and packaging machinery, equipment for materials and container production, packaging components, printing and labelling solutions, and design advances.
Visitors who register in advance will have access to selected privileges, including group arrangements for larger delegations and exclusive on-site support services.
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